Piezoelectric or capacitive MEMS sensors and actuators are used in numerous industrial, medical and commercial applications to control or measure physical parameters. A large number of these elements require high voltages at low power dissipation. Especially for portable and mobile devices, there is thus a need to miniaturize the high voltage driver for MEMS sensors and actuators. Interfacing the MEMS devices with low-power, area-efficient high-voltage application specific integrated circuits (HV ASIC) are a suitable measure for tackling the challenge of the required extreme miniaturization.